Digital process chain – Case study on 3D EWIS modulation at BAU 2015

Many thermal insulation systems currently offer only limited scope for individual design.

The EWIS 3D modulation system variant sees boosting the energy
efficiency of the building envelope not just as an
engineering task, but also as a design opportunity.

The different heat transmission values of the various
building elements in the existing facade serve as a
basis for modelling the surface.

Our iD solutions are based on an integrated digital process chain that
precisely links the design of a 3D model with the
manufacturing and assembly process.